算法工程师（Algorithm Engineer）　　　　　　　　　　　　　　　　　　　　　　　　　　　申请此职位

模拟集成电路设计工程师（Analog IC Design Engineer）　　　　　　　　　　　　　　　　　　　申请此职位

职责：负责模拟集成电路和数模混合集成电路设计；负责定义产品，电路设计，模拟；指导版图工程师设计版图；协助电路测试。
要求：有微电子/电子工程类专业；熟悉CMOS器件的设计和加工工艺；熟悉模拟电路，参加过经典模拟电路设计（Amplifier，ADC，DAC，PLL）的全过程。能把握高速数字电路物理实现中的模拟设计问题的关键点；以电路措施满足应用模拟参数，如SNR、Distortion、Phase noise等。精通HSPICE、HSIM、SPECTRE、MATLAB等基本EDA软件和分析工具；能在面向量产的SoC产品中负责精密模拟电路部分的设计。
Duties: Participate analog and mixed-signal IC design; in charge of specify products, design circuits, simulation and modeling circuits, direct layout engineer’s work; assist circuits’ lab test.
Requirements: Microelectronics or Electrical Engineering major; familiar with CMOS devices’ design and process technologies; familiar analog circuits, participated entire flow of typical circuit designs (such as Amplifier, ADC, DAC, PLL, etc.). A candidate should be capable to master high-speed digital circuits’ physical implementation, addressing these circuits’ analog characteristics, and accordingly suggesting special circuit treatments to fulfill demanding circuit specifications, such as SNR, Distortion, Phase noise, etc. A candidate should be skillfully using basic EDA software and analysis tools, such as HSPICE, HSIM, Spectre, MatLab, etc, and able to take in charge of a precision analog circuit design which is a part of a production-grade SoC.

数字SoC前端设计工程师（SoC Front-end Design Engineer）　　　　　　　　　　　　　　　　　　申请此职位

职责：负责SoC系统复杂数字模块的前端设计、功能验证与可测性设计；配合后端设计工程师实现数字模块的时序收敛与功耗收敛。
要求：了解整个SoC设计流程；熟练使用Verilog硬件描述语言进行可综合设计；了解ESL描述与验证；能熟练使用主流设计工具完成复杂数字模块的设计与验证；熟悉Synopsys DC综合工具与相关测试生成工具的使用。能与资深SoC主设计师直接配合，独立负责在芯片系列产品中的一个派生设计的实现。
Duties: Responsible for front-end design, functional verification and testing design for digital modules in a complex SoC. A candidate needs to coordinate with back-end design engineers toward a closure of digital module’s timing and power convergence.
Requirements: Understand SoC design flow, skillfully use Verilog hardware description language for logic design and synthesize; understand ESL descriptions and related verification, can skillfully use mainstream design tools for accomplishing complex digital modules’ design and verification; can skillfully use Synopsys DC synthesizer and related test-vector generator. A candidate needs to be able to cooperate with a senior SoC chief architect, and be able to independently take-in-chare in implementation of a design variation in an IC product series.

数字SoC后端设计工程师（SoC Physical Design Engineer）　　　　　　　　　　　　　　　　申请此职位

职责：负责SoC系统从网表至流片的后端工序；完成相关的时序与功耗的分析与各个流程的验证；与前端设计工程师和工艺控制工程师紧密配合使SoC产品在最终的性能、功耗、成本等各方面达到最优。
要求：了解整个SoC设计流程；了解前端综合工具的使用与接口；熟练使用主流后端工具完成从网表级至流片的全部流程；熟练使用分析工具进行时序与功耗分析并完成各个步骤间的验证。熟练使用UNIX系统，并能使用UNIX工具（Shell脚本、sed/awk、perl等）提高工作效率。
Duties: Handle SoC designs in back-end stages (from netlist to mask); accomplish timing and power analysis and verification procedures; coordinate with front-end design engineers as well with process engineers-through a seamless interface to accomplish optimized SoC products which meet targeted performance, power consumption and costs.
Requirements: Understand all stages of design processes of a SoC design flow; understand applications of front-end design tools and its interfaces with back-end designs. A candidate should be able to skillfully master the analysis tools used for timing and power analysis, and capable to accomplish verifications between each design stages. A candidate should be very skilled in using UNIX operating system, and can utilize Shell scripts, sed/awk and Pearl, etc. to bring-up the efficiency of the work.

混合信号电路设计和分析工程师（Mixed-signal IC Design Analyst）　　　　　　　　　　 　申请此职位

职责：负责片上系统的电路分析。针对芯片的应用范围，建立实用的数学模型，应用经典信号和噪声分析方法解释和预测电路的性能和现象。总结、分析和报告实验结果。
要求：熟悉MOS器件的基本数学模型和参数应用，研究及观察不同方面的MOSFET特性，如亚微米和纳米模型参数、亚阈值输出特性、MOS光电转换效应等。预测并解释电路系统的性能，如可放大器，比较器，数模转换电路等。熟练使用定制设计EDA工具，尤其掌握专用模拟电路仿真工具（HSPICE），运用MATLAB，Excel和通用编程语言的数据分析方法 。有严谨的研究分析能力，能独立读、写中英文研究文献，并能与资深模拟电路设计师交流，共同评测和改进实验片上系统。熟悉MATLAB，和有ADC设计经验者优先。
Duties: Responsible to circuit analysis upon analog and mixed-signal ICs. Practical modeling of circuits, in accordance to chip’s range of operation, utilizes classical signal and noise analysis to explain and predict circuits’ performance and behaviors. Explain, analyze and report experimental data and results.
Requirements: Familiar with MOS devices’ fundamental modeling and parameter, study and observe various aspects of MOSFET’s characteristics, such as submicron and nanometer device model parameters, linear and sub-threshold output characteristics, MOS optoelectronic effects, etc. A candidate should be able to explain elementary circuit system’s performance, such as amplifier, comparator, DAC circuit, etc. The candidate should be skillful in designs with EDA tools, especially mastering dedicated analog design and simulation tools (HSPICE, etc.), using MATLAB, Excel and general-purpose programming languages to achieve practical data analysis. The candidate is required to have disciplined research and analysis capabilities, can independently read and write research articles in both Chinese and English, as well fluently communicate with senior analog designers so that they can perform evaluation and improvement upon experimental ICs on the same or duplicated platforms. Candidates with experience in using MATLAB and done ADC designs are preferred.

混合信号电路芯片和系统实验工程师（Mixed-signal IC Test Engineer）　　　　　　　　　　　　　　 　　申请此职位

职责：负责芯片原型的实验室测试。针对芯片的应用方案，开发PC驱动和控制的数据采集系统，和实现实验台测试仪器的系统集成和应用。进一步扩展到现场实验和与应用系统的衔接。总结、分析和报考实验结果。
要求：熟悉PCB设计流程；熟练使用Cadence OrCAD/Allegro流程进行系统级设计；了解基于PC的通用接口子系统的应用，了解成像和显示器件的使用。有广泛的应用工程知识，有软、硬件设计，用户界面设计能力。熟悉CMOS芯片测试中的弱电安全、静电保护、小信号噪声环境控制等措施。了解简单光学成像的原理并能动手搭建简单测试环境。有强的动手设计能力，并能与通用测试和计量专业人员交流和评测实验芯片。熟悉Labview，GPIB，或MOS成像器芯片和应用者优先。
Duties: Chip prototype’s lab experiment and measurement. Develop dedicated PC-driven data acquisition systems, and implement an integration of lab instrumentation in accordance to the chip’s solutions toward its applications. Further duties extend to field experiment and system application. Explain, analyze and report experiments and their results.
Requirements: Familiar with PCB design flow; master Cadence OrCAD/Allegro design tools and flow for system-level designs; understand applications of PC-based general-purpose subsystems. A candidate is preferred to be familiar with applications of imager and display devices, especially who understand principles of simple optical imaging, with hands-on capability to build a simple optoelectronic experiment platform. The candidate should possess a broad range of experience in application engineering and ability to design hardware, software and user interface. It’ll be advantageous for safety operation upon small-signal and low-voltage DUTs, ESD protections, small-signal noise environments and treatments, etc. The candidate is required to have hands-on capabilities in system design and assembly, as well capable to work with test and calibration engineers in joint evaluation and experiments upon IC DUTs. Preferred candidates are ones who have experience in MOS imagers and their applications: or familiar with Labview and GPIB.

嵌入式系统设计工程师（Embedded System Design Engineer）　　　　　　　　　　　　　　　　　　　申请此职位

职责：负责设计基于公司SoC产品，针对不同应用的板级解决方案；配合SoC产品开发与测试设计相关电路。完成从产品方案制订到系统级原理图设计的全过程；配合PCB布线工程师完成符合时序与功耗要求的PCB设计；配合嵌入式软件工程师与SoC设计工程师完成软硬件的联合调试。
要求：熟悉系统级设计流程；熟练使用Cadence OrCAD/Allegro流程进行系统级设计；了解基于32位嵌入式SoC芯片搭建的系统；了解电源管理芯片的使用；丰富的动手调试经验；熟练使用逻辑分析仪、示波器等测试手段进行硬件调试。熟悉音视频DSP器件和FPGA应用者优先。
Duties: Develop systems based on the company’s SoC products, towards the products’ various PCB-level solutions. Cooperate with SoC product designers in test fixture development. Accomplish entire solution developments, from specifications to system design; cooperate with PCB layout engineers to complete designs that fulfill targeted timing and power performance. Cooperate with embedded software engineers and SoC engineers to accomplish hardware/software joint implementation.
Requirements: Familiar with system-level design flow; master cadence OrCAD/Allegro tool for system-level designs; master system integration which is based on a 32-bit embedded SoC; understand power management components’ applications and their PCB level solutions. A candidate should be rich in hands-on design and assembly experience, skillfully uses logic analyzer, oscillograph, etc. Ones who are familiar with A/V DSP devices and application of FPGA will be much preferred.

应用工程师（Application Engineer） 　　　　　　　　　　　　　　　　　　　　　　　　　　　　　申请此职位

职责：负责SoC产品的应用技术支持。针对产品的应用方案，支持从芯片产品的开发系统、参考系统、应用系统到客户（系统设计公司）的过程。
要求： 熟悉系统级设计流程；熟练使用Cadence OrCAD/Allegro流程进行系统级设计；了解基于32位嵌入式SoC芯片搭建的系统；了解视频编解码相关芯片使用；了解电源管理芯片的使用；有广泛的应用工程知识，能与软、硬件设计，用户界面设计、安规测试、结构设计等专业人员沟通和交流。熟悉音视频DSP器件和手持系统设计和应用者优先。
Duties: Responsible for SoC product applications and technical supports. Oriented to SoC products’ application solutions, with supporting activities range from the chip’s development system, reference system, application system, customers (system design house) designs through entire design chain and industrial processes;
Requirements: Familiar with system-level design flow; master cadence OrCAD/Allegro tool for system-level designs; master system integration which is based on a 32-bit embedded SoC; understand video codec chips’ applications; understand power management components’ applications and their PCB level solutions. The candidate should possess a broad range of experience in application engineering and ability to communicate effectively with professionals who engage in hardware, software design, user interface design, safety test and structure design. A candidate should be rich in hands-on design and assembly experience, skillfully uses logic analyzer, oscillograph, etc. Ones who are familiar with A/V DSP devices and application of FPGA will be much preferred.

机械结构设计师（Mechanical Design Engineer） 　　　　　　　　　　　　　　　　　　　　　　　　申请此职位

职责：负责SoC产品的在最终系统应用中有关机械结构的设计协调。负责PCB组件和外壳之间的三维接口。针对产品应用方案，参加并协调客户（系统设计公司）和外壳造型设计的联合设计。
要求：熟悉手持电子产品的外壳和外观设计方法和流程，对PCB、接插件，和显示器的机械性能和应用范围有丰富的经验，对专门外壳材料的结构要求、强度特性和加工局限有清楚的了解，能与专业设计公司交流沟通，与电子设计师落实符合批量生产工艺和质量要求的相应措施。精通AutoCAD等专业机电设计工具和通行的设计数据规范。有独立成功地完成商业产品机械结构设计的经历 。
Duties: Responsible for related design and coordination of mechanical structure for SoC products’ final application in systems. And also work for the 3-D interface design between PCB devices and the enclosure mechanism. Oriented to the IC product’s application solutions, the candidate should coordinate and participate in the joint design finishing efforts between customers (system design houses) and enclosure appearance.
Requirements: Familiar with electronic products’ enclosure and exterior design methodology and flow; Rich in experience about mechanical performances and applicable range of PCB, connectors, display devices and other components or materials. Understand clearly about structural designs, strength characteristics and manufacturing limit for dedicated enclosure materials. A candidate should be capable in communicating with professional design houses, working with electronic design engineers on fulfilling measures of quality control and process technology toward mass production.

电磁兼容（EMC）规范工程师（EMC Engineer）　　　　　　　　　　　　　　　　　　　申请此职位

职责：负责SoC产品的应用技术支持。针对产品应用方案，参加并协调客户（系统设计公司）应用系统的EMC设计、测试和改进过程。
要求：熟悉EMC的基本测试项目以及测试过程，掌握产品对应EMC的标准，把握产品的EMC整改定位思路，熟悉产品的各种认证流程，有丰富的产品硬件知识，对电路（主控、接口）等有深度地了解；能建议使用和选择EMC设计整改元器件（电容、磁珠、滤波器、电感、瞬态抑制器件等）使用，掌握，有产品结构屏蔽设计的技能和经验，对EMC设计如何介入产品各个研发阶段流程有经验和见地。相关产品应用标准涉及EMI，ESD，UL，CE，RoHS等等。
Duties: Responsible for SoC products’ applications and technical support. Oriented to application solutions, a candidate needs to coordinate and participate in customers’ (system design houses’) efforts in EMC treatments, tests and improvement upon their application systems.
Requirements: Familiar with elementary test and measurement procedures of EMC; master EMC standards relating to the particular category of the company’s products, and master the basic clue of a product’s improvement; familiar with various certification flow of system products along with their embedded IC components; possess rich experience in the products’ hardware design and deep understanding toward circuit’s (master controller and interface) principles; also can make suggestions about components’ (including capacitor, magnetic core, filter, inductor, instant depressors, etc) choices which would benefit to improvement of EMC characteristics of a system product. A candidate should be able to use and master structural shield mechanism with in-depth knowledge and experience. The candidate needs to be able to provide experience and vision in EMC’s considerations upon various design stages of a system product. General knowledge involves EMC including EMI, ESD, UL, CE, RoHS, etc.

知识产权和专利工程师（IP & Patent Engineer）　　　　　　　　　　　　　　　　　　　申请此职位

职责：承担公司产品的专利知识产权和专利技术管理责任；提供公司产品及市场决策的技术信息；NDA保护的技术文件撰写和管理；提交专利和技术转移；技术上与设计师沟通，参加和指导公司相关业务培训；和专利、法律服务组织工作交流。
要求：有电子类技术专业背景；能阅读和理解中英文文献，中英文写作文字通顺。有相关法律业务知识。能和相关法律服务组织工作交流。
Duties: Responsible for technically managing the company’s patens and intellectual properties; provide technical information regarding company’s product and market decisions; able to write and manage technical documents under NDA; submit application for patent filling and technology transfer; communicate with designers in technical subjects and participate in company’s internal business trainings where some advice is also required; communicate and work with agents who are in patent, laws and other related professions;
Requirements: Technical background in electronics is preferred; able to read and understand both Chinese and English technical paper and references, and also can write fluently in Chinese and English; possess patent and IP related legal knowledge and able to communicate with organizations providing related legal services.